Layer Count: 8 layers
Build-up Technology: 3-step HDI (Sequential Lamination)
Copper Thickness: 4OZ (Heavy Copper)
Core Material: FR-4 (High TG, Consumer Electronics Grade)
Board Thickness: 1.2 mm
Surface Finish: Lead-Free HASL (Halogen-Free, RoHS Compliant)
Min. Line Width / Space: 3/3 mil
Min. Mechanical Drill: 0.2 mm
Min. Laser Drill: 0.1 mm
Solder Mask: Green Solder Mask (Liquid Photoimageable)
Silkscreen: White Legend
Application: Consumer Electronics, Industrial Control