Application: Designed for EV powertrain systems, industrial control units, and high-reliability electronic devices.
Key Specs:
Layers: 4-6 Layer High-Density Structure
Board Thickness: 1.6mm (Customizable: 1.0mm/2.0mm)
Base Material: High-Tg FR-4 (Tg ≥ 170°C), UL 94 V-0
Copper Thickness: 1oz (35μm) (Upgradable to 2oz/3oz)
Surface Finish: Lead-Free HASL / ENIG (Optional)
Solder Mask: Red (White Silkscreen for Clarity)
Min Line Width/Spacing: 3mil/3mil
Min Drill Hole: 0.2mm (Laser Drilling Available)
Quality and Standards:
Compliant with IATF 16949, ISO 13485, and CISPR 25
100% Tested via AOI, X-Ray, Flying Probe, and Hi-Pot
Thermal Shock: -40°C to +125°C (High-Reliability Rating)
Service and Lead Time:
Free DFM Analysis and Engineering Support
24-48h Fast Prototyping | 12-14 Days Mass Production
Customizable for EV Inverter, OBC, BMS, and Industrial Control Applications