Layer Count: 10 layers
Build-up Technology: Standard Rigid PCB (Sequential Lamination)
Product Category: Through-Hole Series
Core Material: FR-4 (High-TG, High Reliability Grade)
Board Thickness: 1.2 mm
Surface Finish: OSP (Organic Solderability Preservative)
Copper Thickness: 1 oz (Standard) / 2 oz (Optional for High-Current Applications)
Solder Mask: Green Solder Mask (Liquid Photoimageable, Halogen-Free)
Silkscreen: White Legend (RoHS Compliant)
Min. Line Width / Space: 4/4 mil
Min. Mechanical Drill: 0.2 mm
Min. Through-Hole Plating: 20 µm (Standard for High-Reliability Through-Hole)
Application: Laptop Computers, Notebook Mainboard